Method of manufacturing organic light-emitting display apparatus

ABSTRACT

A method of manufacturing an organic light-emitting display apparatus includes forming an anode on a substrate, forming a lift-off layer on the substrate including the anode, the lift-off layer including a fluoropolymer, forming a polymer layer on the lift-off layer, forming a pattern on a first portion of the polymer layer overlapping the anode using a roll-to-roll stamp process, etching a first portion of the lift-off layer corresponding to the pattern using a first solvent including fluorine, the first portion of the lift-off layer being disposed on the anode, forming an organic functional layer including a light-emitting layer on the anode and a second portion of the polymer layer not formed with the pattern, removing the lift-off layer using a second solvent including fluorine, and forming a cathode on the organic functional layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2015-0119825, filed on Aug. 25, 2015, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND

Field

Exemplary embodiments relate to a method of manufacturing an organiclight-emitting display apparatus.

Discussion of the Background

Organic light-emitting display apparatuses may be self-luminous displayapparatuses having a hole injection electrode, an electron injectionelectrode, and an organic light-emitting layer between the holeinjection electrode and the electron injection electrode. As holesinjected by the hole injection electrode and electrons injected by theelectron injection electrode are combined and become neutral in theorganic light-emitting layer, light is emitted. An organiclight-emitting display apparatus has been highlighted as a nextgeneration display apparatus having high quality characteristics, forexample, low power consumption, high brightness, and fast responsespeed.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

Exemplary embodiments provide a method of manufacturing an organiclight-emitting display apparatus which may reduce manufacturing coststhereof.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

According to an exemplary embodiment of the present invention, a methodof manufacturing an organic light-emitting display apparatus includesforming an anode on a substrate, forming a lift-off layer on thesubstrate including the anode, the lift-off layer including afluoropolymer, forming a polymer layer on the lift-off layer, forming apattern on a first portion of the polymer layer overlapping the anodeusing a roll-to-roll stamp process, etching a first portion of thelift-off layer corresponding to the pattern using a first solventincluding fluorine, the first portion of the lift-off layer beingdisposed on the anode, forming an organic functional layer including alight-emitting layer on the anode and a second portion of the polymerlayer not formed with the pattern, removing the lift-off layer using asecond solvent including fluorine, and forming a cathode on the organicfunctional layer.

According to an exemplary embodiment of the present invention, a methodof manufacturing an organic light-emitting display apparatus includesforming an anode on a substrate, forming a lift-off layer on thesubstrate including the anode, the lift-off layer including afluoropolymer, forming a pattern on a first portion the lift-off layeroverlapping the anode using a roll-to-roll stamp process, forming anorganic functional layer including a light-emitting layer on the anodeand on a second portion of the lift-off layer not formed with thepattern, removing the lift-off layer using a solvent including fluorine,and forming a cathode on the organic functional layer.

According to an exemplary embodiment of the present invention, a methodof manufacturing an organic light-emitting display apparatus includesforming a first anode and a second anode spaced apart from each other ona substrate, performing a unit process on each of the first and secondanodes, and forming a cathode after performing the unit process for eachof the first and second anodes. The unit process includes forming alift-off layer on the substrate, the lift-off layer including afluoropolymer, forming a polymer layer on the lift-off layer, forming apattern on a first portion of the polymer layer overlapping acorresponding anode using a roll-to-roll stamp process, etching a firstportion of the lift-off layer corresponding to the pattern using a firstsolvent including fluorine, forming an organic functional layerincluding a light-emitting layer on the corresponding anode and on asecond portion of the polymer layer not formed with the pattern, andremoving the lift-off layer using a second solvent including fluorine. Afirst organic light emitting layer disposed on the first anode and asecond organic light emitting layer disposed on the second anode areconfigured to emit different colored light.

According to an exemplary embodiment of the present invention, a methodof manufacturing an organic light-emitting display apparatus includesforming a first anode and a second anode spaced apart from each other ona substrate, performing a unit process on each of the first and secondanodes, and forming a cathode after performing the unit process for eachof the first and second anodes. The unit process includes forming alift-off layer including a fluoropolymer on the substrate, forming apattern on a first portion of the lift-off layer overlapping acorresponding anode using a roll-to-roll stamp process, forming anorganic functional layer including a light-emitting layer on thecorresponding anode and a second portion of the lift-off layer notformed with the pattern, and removing the lift-off layer using a solventincluding fluorine. A first organic light emitting layer disposed on thefirst anode and a second organic light emitting layer disposed on thesecond anode are configured to emit different colored light.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1 is a flowchart of a manufacturing method of an organiclight-emitting display apparatus according to an exemplary embodiment ofthe present invention.

FIG. 2 is a cross-sectional view schematically illustrating anodesformed on a substrate, according to an exemplary embodiment of thepresent invention.

FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, and FIG. 3F arecross-sectional views schematically illustrating a first unit operationof the manufacturing method of FIG. 1.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, and FIG. 4F arecross-sectional views schematically illustrating a second unit operationof the manufacturing method of FIG. 1.

FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, and FIG. 5F arecross-sectional views schematically illustrating a third unit operationof the manufacturing method of FIG. 1.

FIG. 6 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus manufactured by the manufacturing method of FIG. 1.

FIG. 7 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus manufactured by a manufacturing method according to anexemplary embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus manufactured by a manufacturing method according to anexemplary embodiment of the present invention.

FIG. 9 is a flowchart of a manufacturing method of an organiclight-emitting display apparatus according to an exemplary embodiment ofthe present invention.

FIG. 10A, FIG. 10B, FIG. 10C, and FIG. 10D are cross-sectional viewsschematically illustrating a first unit operation of the manufacturingmethod of FIG. 9.

FIG. 11A, FIG. 11B, FIG. 11C, and FIG. 11D are cross-sectional viewsschematically illustrating a second unit operation of the manufacturingmethod of FIG. 9.

FIG. 12A, FIG. 12B, FIG. 12C, and FIG. 12D are cross-sectional viewsschematically illustrating a third unit operation of the manufacturingmethod of FIG. 9.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of isone or more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a flowchart of a manufacturing method of an organiclight-emitting display apparatus according to an exemplary embodiment ofthe present invention.

Referring to FIG. 1, in the method of manufacturing an organiclight-emitting display apparatus 1 according to the present exemplaryembodiment, an anode is formed on a substrate, per step S10. In stepS20, a lift-off layer including fluoropolymer is formed on the substrateincluding the anode. In step S30, a polymer layer is formed on thelift-off layer and a pattern is formed on the polymer layer by aroll-to-roll stamp process.

In step S40, a portion of the lift-off layer, on which the pattern isformed, above the anode, is etched using a first solvent includingfluorine. In step S50, an organic functional layer including alight-emitting layer is formed above the anode and above the area wherethe polymer layer remains. In step S60, the lift-off layer is removed byusing a second solvent including fluorine. In step S70, a cathode isformed on the organic light-emitting layer.

The manufacturing method according to an exemplary embodiment of thepresent invention will be described in detail with reference to FIGS. 2to 6.

FIG. 2 is a cross-sectional view schematically illustrating anodesformed on a substrate according to an exemplary embodiment of thepresent invention. FIGS. 3A to 3F are cross-sectional viewsschematically illustrating a first unit operation of the manufacturingmethod of FIG. 1. FIGS. 4A to 4F are cross-sectional views schematicallyillustrating a second unit operation of the manufacturing method ofFIG. 1. FIGS. 5A to 5F are cross-sectional views schematicallyillustrating a third unit operation of the manufacturing method ofFIG. 1. FIG. 6 is a schematic cross-sectional view of an organiclight-emitting display apparatus 1 manufactured by the manufacturingmethod of FIG. 1.

Referring to FIG. 2, anodes including a first anode 101, a second anode102, and a third anode 103 are formed on a substrate 100.

The substrate 100 may be formed of a flexible material including glassor plastic. For example, the plastic may be formed of a material havingexcellent thermal resistance and durability characteristics, such aspolyimide, polyethylenenaphthalate, polyethyleneterephthalate,polyarylate, polycarbonate, polyetherlmide, or polyethersulfone.

Although not illustrated in FIG. 2, a planar surface may be formed abovethe substrate 100 and a buffer layer (not shown) may be further formedon the planar surface to prevent intrusion of impurities. The bufferlayer may include silicon nitride and/or silicon oxide in a single layeror a multiple layer.

The first, second, and third anodes 101, 102, and 103, as hole injectionelectrodes, may include a material having relatively large workfunction. The first to third anodes 101, 102, and 103 may include atleast one of indium tin oxide, indium zinc oxide, zinc oxide, indiumoxide, indium gallium oxide, and aluminum zinc oxide.

Although not illustrated in FIG. 2, the first, second, and third anodes101, 102, and 103 may be electrically connected to first, second, andthird thin-film transistors (not shown), respectively, located betweenthe substrate 100 and the first to third anodes 101, 102, and 103.

Referring to FIG. 3A, a lift-off layer 120 including fluoropolymer isformed on the substrate 100, on which the first to third anodes 101,102, and 103 are formed.

The fluoropolymer included in the lift-off layer 120 may be a polymerhaving a fluorine content of about 10 to 60 wt %. For example, thefluoropolymer included in the lift-off layer 120 may include at leastone of polytetrafluoroethylene, polychlorotrifluoroethylene,polydichlorodifluoroethylene, a copolymer of chlorotrifluoroethylene anddichlorodifluoroethylene, a copolymer of tetrafluoroethyleneandperfluoroalkylvinylether, a copolymer of chlorotrifluoroethylene andperfluoroalkylvinylether, a copolymer of tetrafluoroethylene andperfluoroalkylvinylether, and a copolymer of chlorotrifluoroethylene andperfluoroalkylvinylether.

The lift-off layer 120 may be formed on the substrate 100 by, forexample, a coating method, a printing method, or a deposition method.When the lift-off layer 120 is formed by a coating method or a printingmethod, a patterning process may be performed after a curing andpolymerization process is performed.

The thickness of the lift-off layer 120 may be equal to or greater thanabout 0.2 μm and equal to or less than about 5 μm. When the thickness ofthe lift-off layer 120 is too thick, a time to melt the lift-off layer120 for patterning increases, which may increase a manufacturing processtime. When the thickness of the lift-off layer 120 is too thin, it maybe difficult to perform a lift-off process.

Referring to FIG. 3B, a polymer layer 130 is formed on the lift-offlayer 120.

The polymer layer 130 may be formed by various polymer materials, whichmay generate glass transition within a temperature range provided by adrive roller DR1 (see FIG. 3C), to form a pattern by a roll-to-rollstamp process, which will be described in more detail with reference toFIG. 3C. The polymer layer 130 may further include UV cured resin orheat cured resin.

A glass transition temperature of the polymer layer 130 may be equal toor greater than 50° C. and equal to or less than 130° C. When thetemperature is too low, it may be difficult to generate glass transitionon the polymer layer 130. When the temperature is too high, thermalstress may be applied to the lift-off layer 120 or an organic functionallayer 151 (see FIG. 3E) including a light-emitting layer.

Referring to FIG. 3C, a first debossed pattern 131 is formed on thepolymer layer 130 by a roll-to-roll stamp process. The structure of FIG.3B is interposed between the drive roller DR1 and a support roller SR1.

While the driver roller DR1 is aligned, such that a first embossedpattern DR11 of the drive roller DR1 is located at a portion of thepolymer layer 130 corresponding to the first anode 101, the drive rollerDR1 is rotated to press the polymer layer 130. The support roller SR1 islocated under the substrate 100 to support the substrate 100, while thedrive roller DR1 proceeds over the polymer layer 130.

The drive roller DR1 may include a temperature regulator (not shown). Atemperature range provided by the drive roller DR1 is higher than aglass transition temperature of the polymer layer 130. The polymer layer130 reaching the glass transition temperature may be in a soft state. Inthis manner, the first debossed pattern 131 is formed in a portion ofthe polymer layer 130 stamped by the first embossed pattern DR11 of thedrive roller DR1.

When the polymer layer 130 includes UV cured resin, the polymer layer130 may be cured by forming the first debossed pattern 131 on thepolymer layer 130 and then directly irradiating a UV light to the firstdebossed pattern 131. When the polymer layer 130 includes heat curedresin, the polymer layer 130 may be cured by forming the first debossedpattern 131 on the polymer layer 130, and then performing a thermaltreatment process on the first debossed pattern 131. An area 136 of thepolymer layer 130, where the first embossed pattern DR11 of the driveroller DR1 does not pass, remains un-patterned.

Although FIG. 3C illustrates a structure of forming the first debossedpattern 131 only on the polymer layer 130, the first debossed pattern131 may be formed on an upper portion of the lift-off layer 120 bychanging the structure of the first embossed pattern DR11 of the driveis roller DR1 or adjusting a stamping pressure.

Referring to FIG. 3D, the lift-off layer 120 is etched by using thefirst debossed pattern 131 formed on the polymer layer 130 of FIG. 3C.

Since the lift-off layer 120 includes fluoropolymer, a solvent capableof etching the fluoropolymer may be used as an etchant. A first solvent(not shown) including fluorine may be used as the etchant. The firstsolvent may include hydrofluoroether. The hydrofluoroether is anelectrochemically stable material due to its low interaction with othermaterials, and is an environmentally stable material due to its lowglobal warming potential and toxicity.

In an etching process, a portion of the lift-off layer 120 correspondingto the first debossed pattern 131, that is, above the first anode 101,is etched. More particularly, the portion of the lift-off layer 120disposed on the first anode 101 is etched using the above-describedfirst solvent including hydrofluoroether.

During the etching of the lift-off layer 120, the first solventincluding fluorine forms a first undercut profile UC1 in the lift-offlayer 120 disposed under an interface of the area 136 (see FIG. 3E),where the polymer layer 130 remains.

The first undercut profile UC1 may enable forming a delicate depositionpattern of the first organic light-emitting layer 151 in a depositionprocess, which will be described in more detail with reference to FIG.3E, and a clear removal of the lift-off layer 120 remaining on thesubstrate 100 in a lift-off process, which will be described in moredetail with reference to FIG. 3F.

Referring to FIG. 3E, a first organic functional layer 150 including afirst organic light-emitting layer 151 is formed on the structure ofFIG. 3D. The first organic functional layer 150 may further include atleast one of a hole injection layer, a hole transport layer, an electrontransport layer, and an electron injection layer. In the presentexemplary embodiment, the first organic light-emitting layer 151 is usedas an example of the first organic functional layer 150. Hereinafter,for descriptive convenience, the first organic functional layer and thefirst organic light-emitting layer may have the same reference numeral.

The first organic light-emitting layer 150 may be formed by a vacuumdeposition method. In the deposition process, the lift-off layer 120 andthe polymer layer 130 function as masks. In this manner, a portion 151of the first organic light-emitting layer 150 is disposed on the firstanode 101, and the first organic light-emitting layer 150 is disposed onthe area 136, where the polymer layer 130 remains.

Referring to FIG. 3F, a lift-off process is performed on the structureof FIG. 3E.

Since the lift-off layer 120 includes fluoropolymer, a second solventincluding fluorine is used in the lift-off process. Since the lift-offprocess is performed after the first organic light-emitting layer 150 isformed, a material having a low reactivity to the organic light-emittinglayer 150 is used as the second solvent. The second solvent may includehydrofluoroether.

As a lift-off layer 126 formed under the area 136 where the polymerlayer 130 remains (see FIG. 3E) is lifted off, the first organiclight-emitting layer 150 disposed on the area 136, where the polymerlayer 130 remains, is removed, and, thus the first organiclight-emitting layer 151 formed on the first anode 101 is left as apattern.

According to the present exemplary embodiment, since the pattern of thefirst organic light-emitting layer 151 is formed in the lift-offprocess, rather than being deposited using a metal mask (not shown)having an opening, a misalignment between the substrate 100 and themetal mask may be prevented. Also, since the patterning of the lift-offlayer 120 is performed by a roll-to-roll stamp process, rather than aphotolithography process, process costs may be reduced.

A second unit process of forming a second organic light-emitting layer162 (see FIG. 4F) emitting light of a color different from that of thefirst organic light-emitting layer 151 is performed in an area where thesecond anode 102 is disposed, after performing the above-described firstunit process. The second unit process will be described below withreference to FIGS. 4A to 4F.

Referring to FIG. 4A, the lift-off layer 120 including fluoropolymer isformed on the substrate 100 where the first, second, and third anodes101, 102, and 103 are formed.

The lift-off layer 120 may include a material that is the same as ordifferent from the fluoropolymer used in the first unit process. Thelift-off layer 120 may be formed on the substrate 100 by, for example, acoating method, a printing method, or a deposition method.

Referring to FIG. 4B, the polymer layer 130 is formed on the lift-offlayer 120.

The polymer layer 130 may be formed by various polymer materials, whichmay generate glass transition within a temperature range provided by adrive roller DR2 (see FIG. 4C), to form a pattern by a roll-to-rollstamp process, which will be described in more detail with reference toFIG. 4C. The polymer layer 130 may include a material that is the sameas or different from the polymer layer used in the first unit process

Referring to FIG. 4C, a second debossed pattern 132 is formed on thepolymer layer 130 by a roll-to-roll stamp process. The structure of FIG.4B is interposed between the drive roller DR2 and a support roller SR2.

While the driver roller DR2 is aligned, such that a second embossedpattern DR22 of the drive roller DR2 is located at a portion of thepolymer layer 130 corresponding to the is second anode 102, the driveroller DR2 is rotated to press the polymer layer 130. The support rollerSR2 is located under the substrate 100 to support the substrate 100,while the drive roller DR2 proceeds over the polymer layer 130.

The polymer layer 130 reaching the glass transition temperature by heattransferred by the drive roller DR2 may be in a soft state. In thismanner, the second debossed pattern 132 is formed in a portion of thepolymer layer 130 stamped by the second embossed pattern DR22 of thedrive roller DR2. An area 137 of the polymer layer 130, where the secondembossed pattern DR22 of the drive roller DR2 does not pass, remainsun-patterned.

Although FIG. 4C illustrates a structure of forming the second debossedpattern 132 only on the polymer layer 130, the second debossed pattern132 may be formed on an upper portion of the lift-off layer 120 bychanging the structure of the second embossed pattern DR22 of the driveroller DR2 or adjusting a stamping pressure.

Referring to FIG. 4D, the lift-off layer 120 is etched by using thesecond debossed pattern 132 formed on the polymer layer 130 of FIG. 4C.Since the lift-off layer 120 includes fluoropolymer, a solvent capableof etching fluoropolymer may be used as an etchant. A first solvent (notshown) including fluorine may be used as the etchant. The first solventmay include hydrofluoroether, as in the above-described first unitprocess. The content of fluorine of the first solvent may be differentfrom that utilized in the in the first unit process.

In the etching process, a portion of the lift-off layer 120corresponding to the second debossed pattern 132, that is, above thesecond anode 102, is etched. More particularly, the portion of thelift-off layer 120 disposed on the second anode 102 is etched using theabove-described first solvent including hydrofluoroether.

During the etching of the lift-off layer 120, the first solventincluding fluorine forms a second undercut profile UC2 in the lift-offlayer 120 disposed under an interface of the area 137 (see FIG. 4E),where the polymer layer 130 remains.

Referring to FIG. 4E, a second organic functional layer 160 including asecond organic light-emitting layer is formed on the structure of FIG.4D. The second organic functional layer 160 may include at least onefunctional layer of a hole injection layer, a hole transport layer, anelectron injection layer, and an electron injection layer. In thepresent exemplary embodiment, the second organic light-emitting layer isused as an example of the second organic functional layer 160.Hereinafter, for convenience of description, the second organicfunctional layer and the second organic light-emitting layer may havethe same reference numeral.

The second organic light-emitting layer 160 may be formed by a vacuumdeposition method. In the deposition process, the lift-off layer 120 andthe polymer layer 130 function as masks. In this manner, a portion 162of the second organic light-emitting layer 160 is disposed on the secondanode 102, and the second organic light-emitting layer 160 is formed onthe area 137, where the polymer layer 130 remains.

Referring to FIG. 4F, a lift-off process is performed on the structureof FIG. 4E.

Since the lift-off layer 120 includes fluoropolymer, a second solventincluding fluorine is used in the lift-off process. Since the lift-offprocess is performed after the second organic light-emitting layer 160is formed, a material having a low reactivity to the second organiclight-emitting layer 160 may be used as the second solvent. The secondsolvent may include hydrofluoroether, like the first solvent.

As a lift-off layer 127 formed under the area 137 (see FIG. 4E), wherethe polymer layer 130 remains, is lifted off, the second organiclight-emitting layer 160 disposed on the area 137, where the polymerlayer 130 remains, is removed, and the second organic light-emittinglayer 162 formed on the second anode 102 is left as a pattern.

A third unit process of forming a third organic light-emitting layer 173(see FIG. 5F) emitting light of a color different from that of the firstand second organic light-emitting layers 151 and 162 is performed in anarea where the third anode 103 is located, after performing theabove-described first and second unit processes. The third unit processwill be described below with reference to FIGS. 5A to 5F.

Referring to FIG. 5A, the lift-off layer 120 including fluoropolymer isformed on the substrate 100 where the first, second, and third anodes101, 102, and 103 are formed.

The lift-off layer 120 may include a material that is the same as ordifferent from the fluoropolymer used in the first and second unitprocesses. The lift-off layer 120 may be formed on the substrate 100 by,for example, a coating method, a printing method, or a depositionmethod.

Referring to FIG. 5B, the polymer layer 130 is formed on the lift-offlayer 120.

The polymer layer 130 may be formed by various polymer materials, whichmay generate glass transition within a temperature range provided by adrive roller DR3 (see FIG. 5C) to form a pattern, by a roll-to-rollstamp process. The polymer layer 130 may include a material that is thesame as or different from the polymer layer used in the first and secondunit processes.

Referring to FIG. 5C, a third debossed pattern 133 is formed on thepolymer layer 130 by a roll-to-roll stamp process. The structure of FIG.5B is interposed between the drive roller DR3 and a support roller SR3.

While the driver roller DR3 is aligned, such that a third embossedpattern DR33 of the drive roller DR3 is located at a portion of thepolymer layer 130 corresponding to the third anode 103, the drive rollerDR3 is rotated to press the polymer layer 130. The support roller SR3 islocated under the substrate 100 to support the substrate 100 while thedrive roller DR3 proceeds over the polymer layer 130.

The polymer layer 130 reaching the glass transition temperature by heattransferred by the drive roller DR3 may be in a soft state. In thismanner, the third debossed pattern 133 is formed in a portion of thepolymer layer 130 stamped by the third embossed pattern DR33 of thedrive roller DR3. An area 138 of the polymer layer 130, where the thirdembossed pattern DR33 of the drive roller DR3 does not pass, remainsun-patterned.

Although FIG. 5C illustrates a structure of forming the third debossedpattern 133 only on the polymer layer 130, the third debossed pattern133 may be formed on an upper portion of the lift-off layer 120 bychanging the structure of the third embossed pattern DR33 of the driveroller DR3 or adjusting a stamping pressure.

Referring to FIG. 5D, the lift-off layer 120 is etched using the thirddebossed pattern 133 formed on the polymer layer 130 of FIG. 5C.

Since the lift-off layer 120 includes fluoropolymer, a solvent capableof etching fluoropolymer may be used as an etchant. A first solvent (notshown) including fluorine may be used as the etchant. The first solventmay include hydrofluoroether, as in the above-described first unitprocess. The content of fluorine in the first solvent may be differentfrom that utilized in the in the first unit process.

In the etching process, a portion of the lift-off layer 120corresponding to the third debossed pattern 133, that is, above thethird anode 103, is etched. More particularly, the portion of thelift-off layer 120 disposed on the third anode 103 is etched using theabove-described first solvent including hydrofluoroether.

During the etching of the lift-off layer 120, the first solventincluding fluorine forms a third undercut profile UC3 in the lift-offlayer 120 disposed under an interface of the area 138 (see FIG. 5E)where the polymer layer 130 remains.

Referring to FIG. 5E, the third organic functional layer 170 including athird organic light-emitting layer is disposed on the structure of FIG.5D. The third organic functional layer 170 may further include at leastone functional layer of a hole injection layer, a hole transport layer,an electron injection layer, and an electron injection layer. In thepresent exemplary embodiment, the third organic light-emitting layer isused as an example of the third organic functional layer 170.Hereinafter for descriptive convenience, the third organic functionallayer and the third organic light-emitting layer may have the samereference numeral.

The third organic light-emitting layer 170 may be formed by a vacuumdeposition method. In the deposition process, the lift-off layer 120 andthe polymer layer 130 function as masks. In this manner, a portion 173of the third organic light-emitting layer 170 is disposed on the thirdanode 103, and the third organic light-emitting layer 170 is formed onthe area 138, where the polymer layer 130 remains.

Referring to FIG. 5F, a lift-off process is performed on the structureof FIG. 5E.

Since the lift-off layer 120 includes fluoropolymer, a second solventincluding fluorine is used in the lift-off process. Since the lift-offprocess is performed after the third organic light-emitting layer 170 isformed, a material having a low reactivity to the third organiclight-emitting layer 170 may be used as the second solvent. The secondsolvent may include hydrofluoroether, like the first solvent.

As a lift-off layer 128 formed under the area 138 (see FIG. 5E), wherethe polymer layer 130 remains, is lifted off, the third organiclight-emitting layer 170 disposed on the area 137, where the polymerlayer 130 remains, is removed, and, thus the portion 173 of the thirdorganic light-emitting layer 170 disposed on the third anode 103 is leftas a pattern.

Referring to FIG. 6, after the first, second, and third organicfunctional layers 151, 162, and 173 are formed through the first,second, and third unit processes, a cathode 180 is disposed thereon as acommon layer.

Although FIG. 6 illustrates that the cathodes 180 formed on the first tothird anodes 101, 102, and 103 are separately formed, the presentdisclosure is not limited thereto and the cathodes 180 may be integrallyformed.

The first, second, and third organic light-emitting layers 151, 162, and173 may emit lights of different colors. The light emitted by the firstto third organic light-emitting layers 151, 162, and 173 may appear as awhite light when mixed together. For example, the first to third organiclight-emitting layers 151, 162, and 173 may emit light of red, green,and blue, respectively. For example, the first to third organiclight-emitting layers 151, 162, and 173 may define subpixels forming aunit pixel of the organic light-emitting display apparatus 1. Theorganic light-emitting display apparatus 1 of FIG. 6 may indicate oneunit pixel.

The organic light-emitting display apparatus according to the presentexemplary embodiment illustrated with reference to FIG. 6 may be appliedto an organic light-emitting display apparatus having multiple unitpixels.

For example, referring to FIG. 3C, in the first unit process, the firstdebossed patterns 131 may be formed on the polymer layer 130 by usingthe drive roller DR1 having the first embossed patterns DR11, and thefirst organic light-emitting layers 151 for emitting a first color maybe simultaneously formed on the first anodes 101 using the firstdebossed patterns 131 as etching masks.

In the second unit process, referring to FIG. 4C, the second debossedpatterns 132 may be formed on the polymer layer 130 by using the driveroller DR2 having the second embossed patterns DR22, and the secondorganic light-emitting layers 162 for emitting a second color may besimultaneously formed on the second anodes 102 using the second debossedpatterns 132 as etching masks.

In the third unit process, referring to FIG. 5C, the third debossedpatterns 133 may be formed on the polymer layer 130 by using the driveroller DR3 having the third embossed patterns DR33, and the thirdorganic light-emitting layers 173 for emitting a third color may besimultaneously formed on the third anodes 103 using the third debossedpatterns 133 as etching masks. In this manner, the organiclight-emitting display apparatus 1 may embody a full color through theabove-described first to third unit processes.

FIG. 7 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 2 manufactured by a manufacturing method according toan exemplary embodiment of the present invention.

A manufacturing method of the organic light-emitting display apparatus 2of FIG. 7 may be similar to the above-described manufacturing method ofthe organic light-emitting display apparatus 1 of FIG. 6. Hereinafter,differences from the above-described manufacturing method of the organiclight-emitting display apparatus 1 of FIG. 6 will be mainly described.

Referring to FIG. 7, first, second, and third anodes 101, 102, and 103are formed on the substrate 100. A pixel-defining layer 110 is disposedto surround the edges of the first to third anodes 101, 102, and 103.The pixel-defining layer 110 defines a light-emitting area and preventsshort-circuit between the first to third anodes 101, 102, and 103 and acathode 180.

In the present exemplary embodiment, the first, second, and third unitprocesses are performed after forming the first to third anodes 101,102, and 103 and the pixel-defining layer 110. Through the first tothird unit processes, the first, second, and third organiclight-emitting layers 151, 162, and 173 are respectively formed on thefirst, second, and third anodes 101, 102, and 103, and the cathode 180is formed as a common layer.

FIG. 8 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 3 manufactured by a manufacturing method according toan exemplary embodiment of the present invention.

A manufacturing method of the organic light-emitting display apparatus 3of FIG. 8 may be similar to the above-described manufacturing method ofthe organic light-emitting display apparatus 2 of FIG. 7. Hereinafter,differences from the above-described manufacturing method of the organiclight-emitting display apparatus 2 of FIG. 7 will be mainly described.

Referring to FIG. 8, anodes including first, second, and third anodes101, 102, and 103 are formed on the substrate 100. The pixel-defininglayer 110 is disposed to surround the edges of the first to third anodes101, 102, and 103. The pixel-defining layer 110 defines a light-emittingarea and prevents short-circuit between the first to third anodes 101,102, and 103 and the cathode 180. In the present exemplary embodiment,the first, second, and third unit processes are performed after formingthe first to third anodes 101, 102, and 103 and the pixel-defining layer110.

In the first unit process, referring back to FIG. 3C, the lift-off layer120 disposed on the first anode 101 is etched by a roll-to-roll stampingprocess and an etching process. Next, the first organic light-emittinglayer 151 is formed on the first anode 101 by a deposition process. Whenthe first organic light-emitting layer 151 is formed, a first auxiliarycathode 181 is continuously deposited on the first organiclight-emitting layer 151 and a lift-off process is performed.

During the lift-off process, a second solvent (not shown) includingfluorine is used. The second solvent including fluorine may damage thefirst organic light-emitting layer 151. As such, the first auxiliarycathode 181 functions as a barrier with respect to the first organiclight-emitting layer 151 during the lift-off process.

After the first unit process, the second unit process is performed.Referring back to FIG. 4C, the lift-off layer 120 disposed on the secondanode 102 is etched by a roll-to-roll stamping process and an etchingprocess. Next, the second organic light-emitting layer 162 is formed onthe second anode 102 by a deposition process. When the second organiclight-emitting layer 162 is formed, a second auxiliary cathode 182 iscontinuously deposited on the second organic light-emitting layer 162,and a lift-off process is performed.

During the lift-off process, a second solvent (not shown) includingfluorine is used. The second solvent including fluorine may damage thesecond organic light-emitting layer 162. As such, the second auxiliarycathode 182 functions as a barrier with respect to the second organiclight-emitting layer 162 during the lift-off process.

After the second unit process, the third unit process is performed.Referring back to FIG. 5C, the lift-off layer 120 disposed on the thirdanode 103 is etched by a roll-to-roll stamping process and an etchingprocess. Next, the third organic light-emitting layer 173 is formed onthe third anode 103 by a deposition process. When the third organiclight-emitting layer 173 is formed, a third auxiliary cathode 183 iscontinuously deposited on the third organic light-emitting layer 173,and a lift-off process is performed.

During the lift-off process, a second solvent (not shown) includingfluorine is used. The second solvent including fluorine may damage thethird organic light-emitting layer 173. As such, the third auxiliarycathode 183 functions as a barrier with respect to the third organiclight-emitting layer 173 during the lift-off process. After the first tothird unit processes are performed, the cathode 180 is formed as acommon layer.

According to the manufacturing method of FIG. 8, since the first,second, and third auxiliary cathodes 181, 182, and 183 are continuouslydeposited on the first, second, and third organic light-emitting layers151, 162, and 173, respectively, during the deposition of the first tothird organic light-emitting layers 151, 162, and 173 in the respectiveunit processes, the first to third organic light-emitting layers 151,162, and 173 may be prevented from being damaged in the subsequentlift-off process. In addition, since the first to third auxiliarycathodes 181, 182, and 183 electrically contact the cathode 180, whichis commonly formed on pixels after the first to third unit processes,voltage drop of the cathode 180 may be prevented.

FIG. 9 is a flowchart of a manufacturing method according to anexemplary embodiment of the present invention.

Referring to FIG. 9, in the method of manufacturing an organiclight-emitting display apparatus 1 according to the present exemplaryembodiment, an anode is formed on a substrate, per step S11. In stepS21, the lift-off layer including fluoropolymer is formed on thesubstrate including the anode, and a pattern is formed on the lift-offlayer by a roll-to-roll stamp process.

In step S31, an organic functional layer including a light-emittinglayer is formed above the anode and above an area where the polymerlayer remains. In step S41, the lift-off layer is removed using asolvent including. In step S51, a cathode is formed on the organiclight-emitting layer.

The manufacturing method according to an exemplary embodiment of thepresent invention is described in detail with reference to FIGS. 10A to12D.

FIGS. 10A to 10D are cross-sectional views schematically illustrating afirst unit operation of the manufacturing method of FIG. 9. FIGS. 11A to11D are cross-sectional views schematically illustrating a second unitoperation of the manufacturing method of FIG. 9. FIGS. 12A to 12D arecross-sectional views schematically illustrating a third unit operationof the manufacturing method of FIG. 9.

Referring to FIG. 10A, a lift-off layer 120 including fluoropolymer isformed on a substrate 100, on which the first to third anodes 101, 102,and 103 are formed.

Referring to FIG. 10B, a first debossed pattern 121 is formed on thelift-off layer 120 by a roll-to-roll stamp process. In the presentexemplary embodiment, the first debossed pattern 121 is formed directlyon the lift-off layer 120 without forming the polymer layer 130 of FIG.3B.

The lift-off layer 120 may include fluoropolymer having a fluorinecontent of about 10 to 60 wt %. The lift-off layer 120 may be formed byvarious polymer materials, which may generate glass transition within atemperature range provided by a drive roller DR4. The structure of FIG.10A is interposed between the drive roller DR4 and a support roller SR4.

A glass transition temperature of the lift-off layer 120 may be equal toor greater than 50° C. and equal to or less than 130° C. When thetemperature is too low, it may be difficult to generate glass transitionon the lift-off layer 120. When the temperature is too high, thermalstress may be applied to an organic functional layer 151 (see FIG. 10C)including a light-emitting layer.

While the driver roller DR4 is aligned, such that a first embossedpattern DR44 of the drive roller DR4 is located at a portion of thelift-off layer 120 corresponding to the first anode 101, the driveroller DR4 is rotated to press the lift-off layer 120. The supportroller SR4 is located under the substrate 100 to support the substrate100 while the drive roller DR4 proceeds over the lift-off layer 120.

A portion of the lift-off layer 120 reaching the glass transitiontemperature, due to heat transferred by the drive roller DR4, may be ina soft state. The first debossed pattern 121 is formed in a portion ofthe lift-off layer 120 stamped by the first embossed pattern DR44 of thedrive roller DR4. An area 126 of the lift-off layer 120, where the firstembossed pattern DR44 of the drive roller DR4 does not pass, remainsun-patterned.

Referring to FIG. 10C, a first organic functional layer 150 includingthe first organic light-emitting layer is formed on the structure ofFIG. 10B. The first organic functional layer 150 may further include atleast one of a hole injection layer, a hole transport layer, an electrontransport layer, and an electron injection layer. In the presentexemplary embodiment, the first organic light-emitting layer is used asan example of the first organic functional layer 150. Hereinafter, thefirst organic functional layer and the first organic light-emittinglayer may have the same reference numeral.

The first organic light-emitting layer 150 may be formed by a vacuumdeposition method. In the deposition process, the lift-off layer 120functions as a mask. In this manner, a portion 151 of the first organiclight-emitting layer 150 is disposed on the first anode 101, and io thefirst organic light-emitting layer 150 is formed in the area 126 wherethe lift-off layer 120 remains.

Referring to FIG. 10D, a lift-off process is performed on the structureof FIG. 10C.

Since the lift-off layer 120 includes fluoropolymer, a second solventincluding fluorine is used in the lift-off process. Since the lift-offprocess is performed after the first organic light-emitting layer 150 isformed, a material having a low reactivity to the organic light-emittinglayer 150 is used as the second solvent. The second solvent may includehydrofluoroether, like the first solvent.

As the lift-off layer 120 disposed in an area 126 is lifted off, thefirst organic light-emitting layer 150 disposed on the area 126, wherethe lift-off layer 120 remains, is removed, and, thus the first organiclight-emitting layer 151 formed on the first anode 101 is left as apattern.

According to the present exemplary embodiment, since the lift-off layer120 is used as an etching mask without separately forming the polymerlayer 130, a manufacturing process may be simplified, and, thus processcosts may be reduced.

A second unit process of forming a second organic light-emitting layer162 (see FIG. 11D) emitting light of a color different from that of thefirst organic light-emitting layer 151 is performed in an area where thesecond anode 102 is disposed, after performing the above-described firstunit process. The second unit process is described below with referenceto FIGS. 11A to 11D.

Referring to FIG. 11A, the lift-off layer 120 including fluoropolymer isformed on the substrate 100, on which the first to third anodes 101,102, and 103 are formed.

Referring to FIG. 11B, a second debossed pattern 122 is formed on thelift-off layer 120 by a roll-to-roll stamp process. In the presentexemplary embodiment, the second debossed pattern 122 is formed directlyon the lift-off layer 120 without forming the polymer layer 130 of FIG.4B.

The lift-off layer 120 may include fluoropolymer having a fluorinecontent of is about 10 to 60 wt %. The lift-off layer 120 may be formedby various polymer materials, which may generate glass transition withina temperature range provided by a drive roller DR5. The structure ofFIG. 11A is interposed between the drive roller DR5 and a support rollerSR5.

While the driver roller DR5 is aligned, such that a second embossedpattern DR55 of the drive roller DR5 is located at a portion of thelift-off layer 120 corresponding to the second anode 102, the driveroller DR5 is rotated to press the lift-off layer 120. The supportroller SR5 is located under the substrate 100 to support the substrate100 while the drive roller DR5 proceeds over the lift-off layer 120.

A portion of the lift-off layer 120 reaching the glass transitiontemperature, due to heat transferred by the drive roller DR5, may be ina soft state. The second debossed pattern 122 is formed in a portion ofthe lift-off layer 120 stamped by the second embossed pattern DR55 ofthe drive roller DR5. An area 127 of the lift-off layer 120, where thesecond embossed pattern DR55 of the drive roller DR5 does not pass,remains un-patterned.

Referring to FIG. 11C, the second organic functional layer 160 includingthe second organic light-emitting layer is formed on the structure ofFIG. 11B. In the present exemplary embodiment, the second organiclight-emitting layer is used as an example of the second organicfunctional layer 160. Hereinafter, for descriptive convenience, thesecond organic functional layer and the second organic light-emittinglayer may have the same reference numeral.

The portion 162 of the second organic light-emitting layer 160 isdisposed on the second anode 102, and the second organic light-emittinglayer 160 is formed in the area 127 where the lift-off layer 120remains.

Referring to FIG. 11D, a lift-off process is performed on the structureof FIG. 11C.

As the lift-off layer 120 disposed in an area 127 is lifted off, thesecond organic light-emitting layer 160 disposed on the area 127, wherethe lift-off layer 120 remains, is removed, and, thus the second organiclight-emitting layer 162 formed on the second anode 102 is left as apattern.

A third unit process of forming a third organic light-emitting layer 173(see FIG. 12D) emitting light of a color different from that of thesecond organic light-emitting layer 162 is performed in an area wherethe third anode 103 is disposed, after performing the above-describedsecond unit process. The third unit process is described below withreference to FIGS. 12A to 12D.

Referring to FIG. 12A, the lift-off layer 120 including fluoropolymer isformed on the substrate 100, on which the first to third anodes 101,102, and 103 are formed.

Referring to FIG. 12B, a third debossed pattern 123 is formed on thelift-off layer 120 by a roll-to-roll stamp process. In the presentexemplary embodiment, the third debossed pattern 123 is formed directlyon the lift-off layer 120 without forming the polymer layer 130 of FIG.5B.

The lift-off layer 120 may include fluoropolymer having a fluorinecontent of about 10 to 60 wt %. The lift-off layer 120 may be formed byvarious polymer materials, which may generate glass transition within atemperature range provided by a drive roller DR6. The structure of FIG.12A is interposed between the drive roller DR6 and a support roller SR6.

While the driver roller DR6 is aligned, such that a third embossedpattern DR66 of the drive roller DR6 is located at a portion of thelift-off layer 120 corresponding to the third anode 103, the driveroller DR6 is rotated to press the lift-off layer 120. The supportroller SR6 is is located under the substrate 100 to support thesubstrate 100 while the drive roller DR6 proceeds over the lift-offlayer 120.

A portion of the lift-off layer 120 reaching the glass transitiontemperature, due to heat transferred by the drive roller DR6, may be ina soft state. The third debossed pattern 123 is formed in a portion ofthe lift-off layer 120 stamped by the third embossed pattern DR66 of thedrive roller DR6. An area 128 of the lift-off layer 120, where the thirdembossed pattern DR66 of the drive roller DR6 does not pass, remainsun-patterned.

Referring to FIG. 12C, the third organic functional layer 170 includingthe third organic light-emitting layer is formed on the structure ofFIG. 12B. In the present exemplary embodiment, the third organiclight-emitting layer is used as an example of the third organicfunctional layer 170. Hereinafter, for descriptive convenience, thethird organic functional layer and the third organic light-emittinglayer may have the same reference numeral.

The portion 173 of the third organic light-emitting layer 170 isdisposed on the s third anode 103, and the third organic light-emittinglayer 170 is formed in the area 128 where the lift-off layer 120remains.

Referring to FIG. 12D, a lift-off process is performed on the structureof FIG. 12C.

As the lift-off layer 120 disposed in an area 128 is lifted off, thethird organic light-emitting layer 170 disposed on the area 128, wherethe lift-off layer 120 remains, is removed, and, thus the third organiclight-emitting layer 173 formed on the third anode 103 is left as apattern.

Although it is not illustrated in the drawings, the above-describedorganic light-emitting apparatuses 1, 2, and 3 may further include anencapsulation member. The encapsulation member may include a glasssubstrate, a metal foil, or a thin film encapsulation layer mixed withan inorganic layer and an organic layer.

As described above, a method of manufacturing an organic light-emittingdisplay apparatus according to the exemplary embodiments of the presentinvention may reduce manufacturing costs.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such exemplary embodiments, but rather to the broader scope of thepresented claims and various obvious modifications and equivalentarrangements.

What is claimed is:
 1. A method of manufacturing an organiclight-emitting display apparatus, the method comprising: forming ananode on a substrate; forming a lift-off layer on the substratecomprising the anode, the lift-off layer comprising a fluoropolymer;forming a polymer layer on the lift-off layer; forming a pattern on afirst portion of the polymer layer overlapping the anode using aroll-to-roll stamp process; etching a first portion of the lift-offlayer corresponding to the pattern using a first solvent comprisingfluorine, the first portion of the lift-off layer being disposed on theanode; forming an organic functional layer comprising a light-emittinglayer on the anode and a second portion of the polymer layer not formedwith the pattern; removing the lift-off layer using a a second solventcomprising fluorine; and forming a cathode on the organic functionallayer.
 2. The method of claim 1, wherein the organic functional layercomprises at least one of a hole injection layer, a hole transportlayer, an electron transport layer, and an electron injection layer. 3.The method of claim 1, wherein the organic functional layer is formed bya deposition process.
 4. The method of claim 1, wherein a fluorinecontent of the fluoropolymer is in a range of about 10 wt % to 60 wt %.5. The method of claim 4, wherein the fluoropolymer comprises at leastone of polytetrafluoroethylene, polychlorotrifluoroethylene,polydichlorodifluoroethylene, a copolymer of chlorotrifluoroethylene anddichlorodifluoroethylene, a copolymer of tetrafluoroethylene andperfluoroalkylvinylether, a copolymer of chlorotrifluoroethylene andperfluoroalkylvinylether, a copolymer of tetrafluoroethylene andperfluoroalkylvinylether, and a copolymer of chlorotrifluoroethylene andperfluoroalkylvinylether.
 6. The method of claim 1, wherein the firstsolvent comprises hydrofluoroether.
 7. The method of claim 1, whereinthe second solvent comprises hydrofluoroether.
 8. The method of claim 1,wherein a glass transition temperature of the polymer layer is in arange of 50° C. to 130° C.
 9. The method of claim 1, wherein etching thefirst portion of the lift-off layer comprises forming an undercutprofile in a second portion of the lift-off layer corresponding to thesecond portion of the polymer layer.
 10. The method of claim 1, furthercomprising: forming a pixel-defining layer surrounding an edge of theanode.
 11. The method of claim 1, further comprising: forming anauxiliary cathode on the organic functional layer, before forming thecathode.
 12. A method of manufacturing an organic light-emitting displayapparatus, the method comprising: forming a first anode and a secondanode spaced apart from each other on a substrate; performing a unitprocess on each of the first and second anodes, the unit processcomprising: forming a lift-off layer on the substrate, the lift-offlayer comprising a fluoropolymer; forming a polymer layer on thelift-off layer; forming a pattern on a first portion of the polymerlayer overlapping a corresponding anode using a roll-to-roll stampprocess; etching a first portion of the lift-off layer corresponding tothe pattern using a first solvent comprising fluorine; forming anorganic functional layer comprising a light-emitting layer on thecorresponding anode and on a second portion of the polymer layer notformed with the pattern; and removing the lift-off layer using a secondsolvent comprising fluorine; and forming a cathode after performing theunit process for each of the first and second anodes, wherein a firstorganic light emitting layer disposed on the first anode and a secondorganic light emitting layer disposed on the second anode are configuredto emit different colored light.
 13. The method of claim 12, wherein thefirst organic light emitting layer and the second organic light emittinglayer are configured to emit mixed light having a white color.
 14. Themethod of claim 12, wherein the unit process further comprises formingorganic light emitting layers configured to emit light having the samecolor.
 15. The method of claim 12, wherein the cathode is integrallyformed on the first and second organic light emitting layers as a commonelectrode.
 16. The method of claim 12, wherein the unit process furthercomprises forming an auxiliary cathode on the organic functional layer,before forming the cathode.